Lead-Free Solders Property and Reliability of Electronics Packaging

DOI Web Site

Bibliographic Information

Other Title
  • 304 鉛フリーはんだ材料物性と電子機器実装の信頼性

Abstract

This paper explains the joint reliability of the electronics packaging which uses lead-free solder. The basic physical properties of the lead-free solder materials as the Sn-Ag-Cu and the Sn-Zn are investigated and compared first. And, the joint reliability of the TSOP lead-type component was examined as one of electronic components with a short fatigue life.

Journal

Keywords

Details 詳細情報について

Report a problem

Back to top