Multilayer Formation of Copper Ions (Cu2+) Deposited onto Self-Assembled Monolayers of Alkanedithiols on Au (111) Surfaces.

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  • Deng Wenli
    National Research Institute for Metals, 1-2-1 Sengen, Tsukuba 305-0047, Japan
  • Fujita Daisuke
    National Research Institute for Metals, 1-2-1 Sengen, Tsukuba 305-0047, Japan
  • Yang Linjing
    Department of Chemistry, New York University, New York, NY 10012, U. S. A.
  • Nejo Hitoshi
    National Research Institute for Metals, 1-2-1 Sengen, Tsukuba 305-0047, Japan
  • Bai Chunli
    Institute of Chemistry, Chinese Academy of Science, Beijing 10080, P. R. China

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  • Multilayer Formation of Copper Ions (Cu〔2+〕) Deposited onto Self-Assembled Monolayers of Alkanedithiols on Au(111) Surfaces
  • Multilayer Formation of Copper Ions (Cu<sup>2+</sup>) Deposited onto Self-Assembled Monolayers of Alkanedithiols on Au (111) Surfaces

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Self-assembled monolayers (SAMs) of 1,5-pentanedithiol and 1,9-nonanedithiol on Au (111) surfaces were used to adsorb copper ions (Cu2+) from an ethanolic solution of cupric chloride (CuCl2) by chemical interaction of thiol groups and copper ions assembling multilayer structures. Ellipsometry, contact angle measurement and X-ray photoelectron spectroscopy (XPS) confirmed that the alkanedithiol molecules formed SAMs with only one-ended thiol groups attached to the gold surface, leaving the other-ended thiol groups free, which is supported by the molecular mechanics calculation. XPS and X-ray Auger electron spectroscopy (XAES) not only indicate that copper ions deposited onto SAMs from the solution by the chemical reaction of copper ions with ended free thiol groups of SAMs, but more importantly demonstrate that copper is present in the +1 oxidation state in the multilayer system. Atomic force microscopy (AFM) was used to observe SAMs and multilayer structures.

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