書誌事項
- タイトル別名
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- Anodic Behaviour of Copper in Alkaline Solution (Part 1)
- エリプソメトリーおよび回転電極法による不働態被膜生成機構について
- On the Mechanism of Passive Film Formation as Revealed by Ellipsometry and Rotating Disk Electrode Methods
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説明
The anodic behaviour of copper has been studied in alkaline solution using a rotating disk electrode and an ellipsometer. Anodic peak currents corresponding to Cu2O and Cu(OH)2-CUO formation during potential sweep were measured at various rotating speeds of Cu electrode. The peak current values showed a linear relationship to square-root of the rotating speed, indicating that the formation of Cu2O and Cu(OH)2-CuO films is controlled by the diffusion process of some species in the solution. A conventional method to prepare the copper substrate was proposed, and the refractive index of copper substrate was estimated to be 1.11-2.42i, which is in good agreement with that reported by other investigators. The refractive index of Cu2O film, formed anodically, was 1.90-0.30i. This film appears to have a loose structure compared with crystalline cuprous oxide. The surface of copper substrate was roughened by anodic oxidation-cathodic reduction treatments.
収録刊行物
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- CORROSION ENGINEERING
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CORROSION ENGINEERING 24 (3), 117-122, 1975
社団法人 腐食防食協会
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詳細情報 詳細情報について
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- CRID
- 1390282681235437952
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- NII論文ID
- 130006024216
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- ISSN
- 18841155
- 00109355
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- データソース種別
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- JaLC
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- 抄録ライセンスフラグ
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