Film Formation Behavior of Copper in Synthetic Freshwater Containing Silica and Chloride Ion

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  • Sakai Masahiro
    College of Design and Manufacturing Technology, Muroran Institute of Technology
  • Araya Shinta
    Division of Aerospace Engineering, Muroran Institute of Technology

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Other Title
  • シリカおよび塩化物イオンを含む人工淡水中における銅の皮膜形成挙動
  • シリカ オヨビ エンカブツ イオン オ フクム ジンコウ タンスイ チュウ ニ オケル ドウ ノ ヒマク ケイセイ キョドウ

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Abstract

A film formed on copper plates immersed in the synthetic freshwater containing silica and chloride ion has been assessed using FT-IR, SEM, EPMA and cathodic reduction. The scale formed on copper plates immersed in 20 ppm Cl− solution without silica composed mainly cuprous oxide (Cu2O) and its morphology was angular shape with facet faces. Granular scales aggregated and deposited on copper plates immersed in the solution containing silica and increased in size and number with immersion period. The composition of the scale was found to be a silicon oxide containing siloxane bonds by FT-IR analysis.

Journal

  • Zairyo-to-Kankyo

    Zairyo-to-Kankyo 62 (3), 107-110, 2013

    Japan Society of Corrosion Engineering

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