Heat Transfer Enhancement Using a Pin Fin Heat Sink Filled with Metal Foams
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- ANDO Kenji
- Research division, Nitto Kogyo Corporation
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- IMAI Yusuke
- 静岡大学 工学部
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- HIRAI Hidekazu
- 静岡大学 工学部
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- NAKAYAMA Akira
- 静岡大学 工学部
Bibliographic Information
- Other Title
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- 発泡金属充填ピンフィンヒートシンクを用いた伝熱促進
Abstract
The recent development of information technologies due to advent of a new generation of semiconductor devices has brought us serious problems associated with high heat generation density. Conventional cooling methods such as fin heat sinks with blowing fans may not be sufficient to solve such serious heat related problems. Thus, in this study, we propose a new kind of heat sink as a solution to the problems, namely, a pin fin heat sink filled with metal foams. A series of exhaustive experiments have been conducted to confirm heat transfer enhancement as results of extended surface area and fluid mixing due to the presence of metal foams. Theoretical consideration has also been made so as to elucidate such heat transfer enhancement mechanism.
Journal
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- TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
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TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B 77 (782), 1958-1967, 2011
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390282681238327040
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- NII Article ID
- 130001433026
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- ISSN
- 18848346
- 03875016
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed