High-Power Operation of Diode Edge-Pumped, Glue-Bonded, Composite Yb:Y<sub>3</sub>Al<sub>5</sub>O<sub>12</sub> Microchip Laser with Ceramic, Undoped YAG Pump Light-Guide
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- Tsunekane Masaki
- Fukui Industrial Support Center Institute for Molecular Science (IMS)
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- Taira Takunori
- Institute for Molecular Science (IMS)
書誌事項
- タイトル別名
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- High-Power Operation of Diode Edge-Pumped, Glue-Bonded, Composite Yb:Y3Al5O12 Microchip Laser with Ceramic, Undoped YAG Pump Light-Guide
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説明
The high-power operation of a diode edge-pumped, composite Yb3+-doped Y3Al5O12 (Yb:YAG) microchip laser has been demonstrated. The novel hybrid composite microchip has a 5-mm-diameter, 300-μm-thickness, single-crystal Yb:YAG core and a transparent ceramic, undoped YAG pump light-guide surrounding the core with the same thickness. The high-reflection coated face of the microchip was bonded to a water-cooled heat-sink by a thermally conductive glue for efficient conduction cooling. The pump light from a fourfold diode stack directly coupled to the light-guide and maximum output powers of 410 W (peak) and 285 W have been successfully obtained at an input pump power of 866 W in quasi-continuous-wave (10 ms, 10 Hz) and continuous-wave operations, respectively, at room temperature.
収録刊行物
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 44 (37-41), L1164-L1167, 2005
The Japan Society of Applied Physics
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詳細情報 詳細情報について
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- CRID
- 1390282681241047552
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- NII論文ID
- 210000059307
- 40006899694
- 130004533546
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- NII書誌ID
- AA11906093
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- ISSN
- 13474065
- 00214922
- http://id.crossref.org/issn/13474065
- http://id.crossref.org/issn/00214922
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- NDL書誌ID
- 7469969
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
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- 使用不可