Enhancement of Surface-Damage Resistance by Removing Subsurface Damage in Fused Silica and Its Dependence on Wavelength
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- Kamimura Tomosumi
- Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology
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- Akamatsu Shigenori
- Kochi National College of Technology
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- Horibe Hideo
- Kochi National College of Technology
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- Shiba Haruya
- Kochi National College of Technology
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- Motokoshi Shinji
- Institute of Laser Engineering, Osaka University
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- Sakamoto Takayasu
- Institute of Laser Engineering, Osaka University
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- Jitsuno Takahisa
- Institute of Laser Engineering, Osaka University
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- Okamato Takayuki
- Okamoto Optics Work, Inc.
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- Yoshida Kunio
- Department of Electronics, Information and Communication Engineering, Osaka Institute of Technology
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説明
A combination of several surface etching techniques and a superprecise polishing process was used to remove subsurface damage from fused silica surface. The effect of subsurface damage removal on laser-damage resistance was determined by measuring the laser-induced damage threshold (LIDT) at 1064 nm, 532 nm, 355 nm and 266 nm. Surface-damage resistance was enhanced as the irradiated laser wavelength shortens. At 266 nm, the greatest advantage was obtained from virtually subsurface removed surfaces. The surface LIDT improved 2.8-fold compared with that of conventionally polished fused silica surfaces.
収録刊行物
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 43 (9A/B), L1229-L1231, 2004
The Japan Society of Applied Physics
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詳細情報 詳細情報について
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- CRID
- 1390282681243276288
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- NII論文ID
- 10013573047
- 130004532860
- 210000056971
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- NII書誌ID
- AA10650595
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- ISSN
- 13474065
- 00214922
- http://id.crossref.org/issn/00214922
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- NDL書誌ID
- 7079772
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可