Influence of a Photo-Acid Generator on the Photoreactivity of a Photosensitive Polyimide Containing Epoxy Groups.

Yu Han Sung, Yamashita Takashi, Horie Kazuyuki

doi:10.1295/polymj.28.703

Photochemical reactivity of a polyimide containing epoxy groups, PI(6FDA/ep-AHHFP), was studied in the presence of diphenyl-iodonium 9,10-dimethylanthracene-2-sulfonate (DIAS) as a photo-acid generator. IR spectroscopy was used for measuring the extent of ring-opening polymerization of epoxy groups, which was influenced by photoirradiation and post-cure conditions. By DIAS having an absorption band in 350–410 nm, the irradiation time was shortened by twenty times for getting the same conversion compared to the previous case with diphenyliodonium hexafluoroarsenate (DPI-AsF₆). The activation energy for epoxy polymerization of PI(6FDA/ep-AHHFP) with DIAS was about 14 kJ mol⁻¹. The kinetic chain length, v, per one acid in PI(6FDA/ep-AHHFP) with DIAS was calculated to be about 4–31. The reaction radius, r_R, of an acid is about 8–16 Å when heated for 5–40 min at 50–195°C, which is about half for DPI-AsF₆. The gel dose, D_0gel, and contrast, γ, based on incident energy after post-cure at 100°C for 30 min are 117 mJ cm⁻² and 4.0, respectively. The quantum yield for crosslinking of PI(6FDA/ep-AHHFP), Φ_gel, was 0.084 from the characteristic curve. PI(6FDA/ep-AHHFP) containing DIAS works as a negative-tone photosensitive polyimide.

Influence of a Photo-Acid Generator on the Photoreactivity of a Photosensitive Polyimide Containing Epoxy Groups.

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