Wettability and bonding strength between copper base alloys and sintered Al2O3 compacts.

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  • Ａｌ２Ｏ３焼結体に対する銅合金のぬれ性と接合性
  • Al2O3 ショウケツタイ ニ タイスル ドウ ゴウキン ノ ヌレセイ ト セ

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Abstract

Studies on the wettability and the bonding of Cu-Sn-Ti system (pure metals except for Ti, binary alloys and a ternary alloy) against sintered Al2O3 compacts were carried out. Results obtained were as follows:<BR>(1) Wettability of Cu, Sn pure metals, Cu-10%Sn and Cu-5%Ti binary alloys in vacuum (1.3×10-2-4.0×10-3 Pa) were unsatisfactory. On the other hand, Cu-10%Sn-5%Ti ternary alloy was comparatively wettable, where reaction layer corresponding to Ti3Al containing slight Cu and Sn was formed in the interface between brazing alloy and sintered Al2O3 compact. Sn-5%Ti binary alloy against sintered Al2O3 showed fairly excellent wettability, but did not form any reaction layer between them.<BR>(2) Bonding strength of sintered Al2O3 compacts brazed with Cu, Sn pure metals and Cu-10%Sn or Cu-5%Ti binary alloys had a tendency to decrease with increasing the degree of vacuum (or with decreasing oxygen partial pressure) of bonding atmosphere. Bonding strength of sintered Al2O3 compacts brazed with Sn-5%Ti and Cu-l0%Sn-5%Ti alloys which were good wettable to sintered Al2O3 were comparatively high, and those had a tendency to increase with raising bonding temperature.

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