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Solder Composite Copper Cored Micro-ball for Inner-bump.
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- Mizukami Masahiko
- Material Research dept., Allied-Material Corp.
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- Yoshida Hiroshi
- Material Research dept., Allied-Material Corp.
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- Ichida Akira
- Material Research dept., Allied-Material Corp.
Bibliographic Information
- Other Title
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- 電子部品・材料 インナーバンプ用はんだ複合銅コアマイクロボール
- ギジュツ ソクホウ インナーバンプヨウ ハンダ フクゴウ ドウ コアマイクロボール
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Description
Micro-ball bump technology has been developed for high density flip chip (FC) interconnection of high Performance LSI chips. Thick solder plated balls with copper core of 40-100μm diameter were prepared and tested. This micro-ball is valuable for inner-bump of high density stacked package.
Journal
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- Journal of the Japan Society of Powder and Powder Metallurgy
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Journal of the Japan Society of Powder and Powder Metallurgy 49 (3), 237-241, 2002
Japan Society of Powder and Powder Metallurgy
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Details 詳細情報について
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- CRID
- 1390282681285042816
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- NII Article ID
- 10008007644
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- NII Book ID
- AN00222724
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- ISSN
- 18809014
- 05328799
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- NDL BIB ID
- 6126607
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed