Solder Composite Copper Cored Micro-ball for Inner-bump.

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  • 電子部品・材料  インナーバンプ用はんだ複合銅コアマイクロボール
  • ギジュツ ソクホウ インナーバンプヨウ ハンダ フクゴウ ドウ コアマイクロボール

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Description

Micro-ball bump technology has been developed for high density flip chip (FC) interconnection of high Performance LSI chips. Thick solder plated balls with copper core of 40-100μm diameter were prepared and tested. This micro-ball is valuable for inner-bump of high density stacked package.

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