書誌事項
- タイトル別名
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- Bonding of Refractory Metals by Plasma Activated Sintering.
- パルス ツウデン カアツ ショウケツホウ ニ ヨル コウユウテン キンゾク ノ
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抄録
Plasma activated sintering (PAS) is a kind of hot pressing method. This sintering method is usually for powder sintering. But, it is very effective method for bonding of refractory metals to refractory metals such as tungsten, too. Purpose of this research is to make the ion gun parts (arc chamber) of ion implantation devices by bonding method. Usually, molybdenum is used for the parts. With increasingly high integration in IC memory, the problem of contamination of wafer due to molybdenum arose and therefore the parts made of tungsten are preferred by the industries. However, tungsten is too hard to be formed into the parts by conventional machining process.<BR>The bonded joints of tungsten in the different bonding conditions (temperature, pressure, without interlayer, with interlayer of tungsten or tantalum powder) were evaluated by an optical microscope, an ultrasonic imaging and four point bending test. As a result, bending strength of the joints with interlayer of tantalum powder, tungsten powder and without any interlayer was measured to be about 400, 200 and 100MPa, respectively.
収録刊行物
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- 粉体および粉末冶金
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粉体および粉末冶金 45 (10), 915-919, 1998
一般社団法人 粉体粉末冶金協会
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詳細情報 詳細情報について
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- CRID
- 1390282681285199104
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- NII論文ID
- 10002052931
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- NII書誌ID
- AN00222724
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- COI
- 1:CAS:528:DyaK1cXnsFGqs7k%3D
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- ISSN
- 18809014
- 05328799
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- NDL書誌ID
- 4585453
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可