書誌事項
- タイトル別名
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- Effect of Boron Addition on the Thermal Conductivity of Cu/Diamond Composites Fabricated by SPS
- SPS セイケイ シタ ドウ/ダイヤモンド フクゴウ ザイリョウ ノ ネツ デンドウリツ ニ オヨボス ボロン テンカ ノ エイキョウ
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説明
Diamond-particle-dispersed-copper (Cu) matrix composites were fabricated by spark plasma sintering (SPS) process from the mixture of diamond particles, pure–Cu and boron (B) powders. The microstructures and thermal conductivities of the composites fabricated were examined. These composites were all well consolidated at a temperature of 1173 K for 600 s by spark plasma sintering (SPS) process. No reaction at the interface between the diamond particle and the Cu matrix was observed by scanning electron microscopy and X-ray diffraction analysis for the composites fabricated under the sintering condition employed in the present study. The relative packing density of the diamond particle dispersed Cu matrix composites with B addition was 3.5～6.1 % higher than that without B addition. The thermal conductivity of the Cu/diamond composite drastically increased with B addition. The thermal conductivity of (Cu–B)–50 vol% diamond composites was 594～689 W/mK in a volume fraction range of B between 1.8 and 13.8 vol% in Cu matrix. Numerous transgranular fractures of diamond particles were observed on the bending fracture surface of diamond particle dispersed Cu matrix composites with B addition, indicating strong bonding between the diamond particle and the Cu matrix in the composite.
収録刊行物
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- 粉体および粉末冶金
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粉体および粉末冶金 62 (1), 27-34, 2015
一般社団法人 粉体粉末冶金協会
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詳細情報 詳細情報について
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- CRID
- 1390282681287902208
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- NII論文ID
- 130005060876
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- NII書誌ID
- AN00222724
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- ISSN
- 18809014
- 05328799
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- NDL書誌ID
- 026039196
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- 抄録ライセンスフラグ
- 使用不可
