Development of an Al-Cu-Si-X alloy low-melting-point-braze for the aluminum alloy/ceramics joining

DOI 4 References

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Other Title
  • Ａｌ‐Ｃｕ‐Ｓｉ‐Ｘ系低融点ろう材の開発とセラミックとアルミニウム合金の接合

Description

The development of a low-melting-point-braze based on the Al-Cu-Si ternary eutectic composition with Zn and the joining of Si3N4/Al alloy were investigated. The Al-27.1%Cu-4.7%Si-50%Zn alloy which has solidus point 687 K and liquidus point 699 K was made into the brazing foil using by a Rapid Quenching Device. The joining strength was obtained about 180 MPa at 773 K in the atmosphere of flowing N2. It was considered that Zn restrained to form the Al2Cu layer at the joining interface, because Zn made the copper solubility limit in aluminum increase and the copper diffusion into the aluminum alloy promote.

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Details 詳細情報について

  • CRID
    1390282681317630720
  • NII Article ID
    130004481708
  • DOI
    10.2464/jilm.55.489
  • COI
    1:CAS:528:DC%2BD2MXhtlWht7bJ
  • ISSN
    18808018
    04515994
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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