Detection of Excess CSP Solder Ball by Laser Through-Beam Sensor
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- SATO Unkai
- Faculty of Education, Shinshu University
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- YAMAZAKI Takao
- 長野県立工科短期大学校
Bibliographic Information
- Other Title
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- レーザ判別センサによる過剰CSP半田ボールの検出
- レーザ ハンベツ センサ ニ ヨル カジョウ CSP ハンダ ボール ノ ケンシュツ
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Abstract
At the solder ball mounting process on the CSP (chip size package) package, must have inspection of excess solder on the inhaling tool. This study is how to detect excess solder during inhaling tool moving when using laser through-beam sensor. First, in order to remove the influence of the sensor output value by the normal solder ball and to extract only the sensor output value by the excess solder ball, the gobo was attached to the inhaling tool and the effect was checked. Next, create a slit on the laser receiver that increasing sensitivity of laser through-beam sensor and confirmed the improvement. The slit is created to increase sensor output value that compares result of excess solder on the inhaling tool with or without excess solder ball. Furthermore, we supposition production line study the inhaling tool movement error. Therefore then inhaling tool movement error is occur then measure sensor output value. Then we attempt to use difference value. It turns out that the detection method developed by this research can apply to manufacture line, because the excess solder ball of φ 0.30 mm, φ 0.25 mm and φ.0.18 mm can be detected certainly, without being influenced of the movement error of inhaling tool.
Journal
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- TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
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TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C 71 (703), 1011-1017, 2005
The Japan Society of Mechanical Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1390282681332988288
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- NII Article ID
- 110006264627
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- NII Book ID
- AN00187463
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- ISSN
- 18848354
- 03875024
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- NDL BIB ID
- 7294103
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed