Evaluation of Cutting Forces for Intermetallic Compounds Formed on Solder Joint Interface by Instrumented Ultramicrotome
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- Yorita Chiko
- Production Engineering Research Laboratory, Hitachi, Ltd.
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- Imamura Yuko
- Toshiba Nanoanalysis Corporation
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- Hirohata Yasuhisa
- Central Institute for Electron Microscopic Researches, Nippon Medical School
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- Asakura Kentaro
- Department of Materials Engineering, School of Engineering, The University of Tokyo
Bibliographic Information
- Other Title
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- 計装化ウルトラミクロトームを用いたはんだ接続部に生成する金属間化合物の切削力評価
- ケイソウカ ウルトラミクロトーム オ モチイタ ハンダ セツゾクブ ニ セイセイ スル キンゾク カン カゴウブツ ノ セッサクリョク ヒョウカ
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Abstract
Observing interface states is especially important in evaluating solder joint reliability. Cross-section samples of intermetallic compounds generated by copper metallization with lead-free solders (Sn8Zn3Bi, and Sn9Zn, Sn3Ag0.5Cu), with Sn37Pb as a reference, were prepared using an ultramicrotome. We used an instrumented ultramicrotome to study the cutting force profiles of the intermetallic compounds. When we measured them with a needle-like diamond knife (60 μm in width), we found peaks in the profiles consisting of two elements that corresponded to those of the intermetallic compounds. These profiles also correlated well with the hardness of the constituent phases at the solder joint interface.
Journal
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- Journal of the Japan Institute of Metals and Materials
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Journal of the Japan Institute of Metals and Materials 68 (5), 282-287, 2004
The Japan Institute of Metals and Materials
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Keywords
Details 詳細情報について
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- CRID
- 1390282681454501248
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- NII Article ID
- 10013070478
- 30018843110
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- NII Book ID
- AN00187860
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- ISSN
- 18806880
- 24337501
- 00214876
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- NDL BIB ID
- 6972481
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed