Fracture Mechanism of Interface between Aluminum and Aluminum Nitride during Thermal Cycling

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  • アルミニウム／窒化アルミニウム界面の冷熱サイクル試験による破壊機構

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  Fracture mechanism of the interface between an aluminum layer and an aluminum nitride plate during thermal cycling was studied. Observation of the interface with an ultrasonic flaw detector indicated that a crack was generated at an edge of the aluminum layer after approximately 2000 thermal cycles. Cross-section observation using SEM-ASB (Angle Selective Backscattered electron detector) revealed that the crack propagated into the aluminum layer and ran along the interface. The size of aluminum grains around the tip of the crack is 0.2-1.0 μm. This size is much smaller than that in the initial aluminum layer, which was approximately 500 μm. It is considered that the reduction in the size of aluminum grains was due to the accumulation of strains in the aluminum layer during the thermal cycling. Observations using SEM-ASB of higher magnification and TEM revealed that the crack was formed in the aluminum layer during thermal cycling, and propagated along the aluminum grain boundaries.<br>

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