書誌事項
- タイトル別名
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- Effect of Dissolved Sulphur on the Surface Tension of Liquid Copper (Fundamental Studies on Cermet, Part 4)
- ヨウユウ ドウ ノ ヒョウメン チョウリョク ニ オヨボス イオウ ノ エイキョウ
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The effect of dissolved sulphur on the surface tension of liquid copper has been measured by the sessile drop method at 1114°, 1200°, 1300° and 1340°C. Sulphur is highly “surface active” in liquid copper, and at a sulphur content of 0.6%, the surface tension is lowered by about 620 dyn·cm−1 at 1114°, 580 dyn·cm−1 at 1200°, 530 dyn·cm−1 at 1300° and 470 dyn·cm−1 at 1340°C, respectively. The degree of adsorption of sulphur on the liquid copper surface has been calculated and the result indicates that the maximum surface excess of sulphur is about 1.6×10−9 mol·cm−2, which corresponds to a mono-molecular layer of Cu2S or S−−.
収録刊行物
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- 日本金属学会誌
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日本金属学会誌 24 (6), 374-377, 1960
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282681457909760
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- NII論文ID
- 40018257712
- 130007332592
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- NII書誌ID
- AN00187860
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- ISSN
- 18806880
- 24337501
- 00214876
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- NDL書誌ID
- 9153152
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- データソース種別
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- JaLC
- NDL
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