A Transmission Electron-Microscopical Study of Work Hardening of Copper Foil Crystals

  • Sumino K.
    The Research Institute for Iron, Steel and Other Metals, Tohoku University
  • Yamamoto M.
    The Research Institute for Iron, Steel and Other Metals, Tohoku University
  • Kawasaki Y.
    The Research Institute for Iron, Steel and Other Metals, Tohoku University
  • Sumino M.P.
    Faculty of Engineering, Tohoku University

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Other Title
  • 銅薄膜結晶における加工硬化の透過電顕的研究
  • ドウ ハクマク ケッショウ ニ オケル カコウ コウカ ノ トウカデンケンテキ ケンキュウ

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Abstract

In order to elucidate the relationship between the work-hardening characteristics of copper foil crystals 10.0 and 50.8 microns thick, which were determined in a previous paper, and dislocation phenomena occurring in them, a treansmission electron-microscopical observations have been made on distribution patterns of residual dislocation in the foil crystals as dependent on the strain, tensile direction, and specimen thickness during deformation.<BR>Dislocation tangles have been observed already at an early stage of deformation in a foil crystal showing the lowest value of the work-hardening rate. Dislocation tangles developing over only one slip plane have been found in foil crystals showing low-hardening rates. On the other hand, the development of cell structure has been found always in foil crystals with high work-hardening rates. The dislocation cell structure becomes more complex and its size decreases as the strain increases. Dislocation configurations which can be regarded as showing the formation of sessile dislocations and the pile-up against them have also been observed.<BR>It is suggested that the dislocation cell structure is formed as the result of irregular and complex motions of dislocations due to the complex distribution of the internal stress field originated from dislocations accumulated in foil crystals during deformation.

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