動的条件下におけるNi, Cuの液体Biへの溶解現象

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タイトル別名
  • On the Dissolution of Solid Nickel and Copper in Liquid Bismuth under the Dynamic Condition
  • ドウテキ ジョウケン カ ニ オケル Ni , Cu ノ エキタイ Bi エ ノ ヨウカイ ゲンショウ

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A kinetic study of the dissolution of solid Ni and Cu in liquid Bi has been made under the dynamic and isothermal conditions. The experiments were carried out at given temperatures in the range of 370°∼475°C and at constant peripheral speeds of rotating solid specimen in the range of 0∼52 cm/sec, following the dissolution process was examined by analyzing the whole sample drawn from a reaction vessel after the predetermined time of dissolution. The rates of dissolution of Ni and Cu in liquid Bi thus obtained have been found to conform to an unimolecular reaction law expressed in the form of n=ns{1−exp(−k·S⁄V·t)}, which is identical to one applied previously to these systems under the static condition. The values of the solution rate constant obtained for both systems were significantly higher than those under the static condition and increased in proportion to about six-tenths power of the peripheral speed. From these facts it was confirmed that the rates of dissolution of Ni and Cu in liquid Bi can be determined by the rate of transfer of dissolved particle through the diffusion layer in solid-liquid interface. It was also shown that the evaluated values of activation energy for dissolution of both systems were appreciably lower than those obtained under the static condition and decreased slightly with the increase in peripheral speed. These results are reviewed on the basis of the diffusion mechanism in liquid.

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  • 日本金属学会誌

    日本金属学会誌 28 (3), 111-116, 1964

    公益社団法人 日本金属学会

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