合金における高温クリープと拡散との関連性

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タイトル別名
  • Relation between High-Temperature Creep and Diffusion in Alloys (On the Relation between High-Temperature Creep and Diffusion in Nickel-Base Solid Solutions. VII)
  • ゴウキン ニ オケル コウオン クリープ ト カクサン ト ノ カンレンセイ

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抄録

Comparison between steady state creep characteristics at high temperatures and lattice-diffusion characteristics of components has been made on nickel-copper, nickel-chromium, and nickel-tungsten alloys using the data reported previously by the present authors. It is found that : (1) The activation energy for the steady state creep (Qs) is close to that for the lattice self-diffusion (QD) of component in the alloys. In nickel-copper alloy, especially, Qs are almost equal to QD of copper atom which diffuses more rapidly than nickel atom in the alloys. Whereas, in nickel-tungsten alloys, it appears that Qs comes to be strongly related to QD of tungsten atom (slower diffusant) as the tungsten content increases. (2) According to the analysis of Weertman, changes in Qs and in stress exponent (n) show that the rate controlling process in the steady state creep is the climbing motion of dislocations in nickel-copper and nickel-chromium systems, as in the case of pure metals. In the nickel-tungsten system, however, the process seems to be altered as the tungsten content increases. (3) When the steady state creep rates (\dotεs) are related to the diffusion coefficients of vacancies (DV) and the applied stresses (σ) by \dotεs=C′σnDV, C′ is found to be independent of temperatures (and of applied stresses too) and to decrease always with increasing solute contents, even in the alloys of similar grain size.

収録刊行物

  • 日本金属学会誌

    日本金属学会誌 28 (6), 308-312, 1964

    公益社団法人 日本金属学会

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