Surface Tension of Liquid Copper in Dilute Oxygen Concentrations

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  • Morita Zen-ichiro
    Department of Metallurgy, Faculty of Engineering, Osaka University
  • Kasama Akio
    Department of Metallurgy, Faculty of Engineering, Osaka University

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  • 希薄酸素濃度域における溶銅の表面張力について
  • キハク サンソ ノウドイキ ニ オケル ヨウドウ ノ ヒョウメン チョウリョク

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The effect of a minute amount of dissolved oxygen below 0.02 at% on the surface tension of liquid copper has been measured by the sessile drop method at 1100, 1200, 1300 and 1400°C. Surface tension of copper over the region of dilute oxygen concentrations decreased with increasing partial pressure of oxygen in the atmosphere, and this tendency was remarkable at lower temperatures. The temperature coefficient of surface tension of liquid copper changed from negative to positive with increasing oxygen content. It can therefore be presumed that the results reported by Krause and by Pugachevich et al., in which the surface tension of liquid copper increasing with increasing temperature may be caused by the presence of a slight amount of oxygen in the atmosphere or specimen. Furthermore, it was found that an approximate linear relationship existed between the surface tension of liquid copper and the amount of adsorved oxygen on the liquid copper surface.

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