Grain Boundary Migration of Silver under Compression at 500°C

DOI Web Site Web Site 1 Citations

Bibliographic Information

Other Title
  • 銀の高温圧縮中における粒界移動
  • ギン ノ コウオン アッシュク チュウ ニ オケル リュウカイ イドウ
  • Grain Boundary Migration of Silver under Compression at 500°C

Search this article

Abstract

Grain boundary migration of poly- and bi-crystalline silver under compression at 500°C was observed with an optical microscope. The results obtained in poly-crystalline specimens are as follows: (1) One grain was absorved by the surrounding grains. (2) The direction of grain boundary migration was rotated around a triple point. (3) Twin boundaries intersecting a grain boundary restrained migration of the grain boundary.<BR>When a bi-crystalline specimen was subjected to strain gradient compression, the grain boundary migrated at first to the center of curveture (to low strain side) and then to the high strain side. The driving force of the grain boundary migration was thought to arise from grain boundary energy in the initial stage and from stored energy of deformation in the following one. The acceleration of grain boundary migration under applied plastic stress was interpreted as due to strain enhanced self-diffusion in grain boundary.

Journal

Citations (1)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top