書誌事項
- タイトル別名
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- Corrosion Behavior of Aluminum in a Strong Acidic Solution for Post-wiring Process
- キョウサンセイ ハイセン アトショリエキチュウ デノ アルミニウム ノ フショク キョドウ
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説明
In the semiconductor manufacturing process, aluminum wiring is formed by reactive ion etching (RIE), and followed by residue removal by ashing and immersing wafers in post-processing solution. Inorganic based composition makes the post-processing solution become more environmentally friendly. Nevertheless, the post-processing solution often causes corrosion in the liquid phase processing. In this report, we evaluated the behavior of aluminum in a strong acidic post-processing solution, i.e., the characteristics of the galvanic corrosion, and the effects of corrosion inhibitor. It was observed that the galvanic corrosion occurred on aluminum counterpart of titanium nitride used as a barrier metal. However, it was found that by adding the ammonium polyphosphate, a corrosion inhibitor, into the post-processing solution, corrosion could be suppressed.
収録刊行物
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- Electrochemistry
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Electrochemistry 77 (1), 63-67, 2009
公益社団法人 電気化学会
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詳細情報 詳細情報について
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- CRID
- 1390282681473234944
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- NII論文ID
- 10024656070
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- NII書誌ID
- AN00151637
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- COI
- 1:CAS:528:DC%2BD1MXjt1Cquw%3D%3D
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- ISSN
- 21862451
- 13443542
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- NDL書誌ID
- 9771041
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用可
