Al粉末を用いた軟鋼基材へのAl層のクラッド加工およびその組織と特性
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- Otsubo Fumitaka
- Center for Instrumental Analysis, Kyushu Institute of Technology
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- Era Hidenori
- Faculty of Engineering, Kyushu Institute of Technology
書誌事項
- タイトル別名
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- Cladding of Al Layer onto Mild Steel Substrate Using Al Powder and Its Structure and Properties
- Al フンマツ オ モチイタ ナンコウ キザイ エ ノ Alソウ ノ クラッド カコウ オヨビ ソノ ソシキ ト トクセイ
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説明
<p>Pure aluminum powder with grain sizes of 45 to 10 µm preformed on aluminum (A1050) and mild steel (SPCC) substrates were rolled to form cladding materials at room temperature in air. The partial rolling reduction of the Al cladding layer was smaller than that of the A1050 substrate in an Al powder/A1050 cladding sheet. In contrast, the partial rolling reduction of the Al cladding layer was larger than that of the SPCC substrate in an Al powder/SPCC cladding sheet. The difference in the partial rolling reduction of the cladding layers and SPCC substrates became smaller with increasing total rolling reduction of the Al powder/SPCC cladding sheets. The shear adhesion strength of the Al powder/SPCC cladding sheet was about 40 MPa, which decreased to about 10 MPa after heat treatment at 773 K for 3.6 ks. The intermetallic compounds were formed between the cladding layer and the substrate after heat treatment at 773 K for 3.6 ks. Also, the cladding layer showed excellent oxidation resistance compared with cast iron after heat treatment at 1073 K for 36 ks in air, though light oxidation occurred in specimens after heat treatment at 773 K for 36 ks in air.</p><p> </p><p>This Paper was Originally Published in Japanese in J. JSTP 58 (2017) 582–586.</p>
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 59 (10), 1585-1590, 2018-10-01
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390001288070835712
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- NII論文ID
- 130005858702
- 130007487555
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- NII書誌ID
- AN00135062
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- ISSN
- 13475320
- 18820166
- 13459678
- 00381586
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- Web Site
- http://id.ndl.go.jp/bib/028410591
- https://ndlsearch.ndl.go.jp/books/R000000004-I028410591
- http://id.ndl.go.jp/bib/029251544
- https://ndlsearch.ndl.go.jp/books/R000000004-I029251544
- https://www.jstage.jst.go.jp/article/sosei/58/678/58_582/_pdf
- https://www.jstage.jst.go.jp/article/matertrans/59/10/59_P-M2018835/_pdf
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- en
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