低圧トランスファー成形用エポキシ樹脂の管内流動と熱伝導
書誌事項
- タイトル別名
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- Flow and heat transfer of an epoxy molding compound for low pressure transfer molding in channels.
説明
Flow and heat transfer characteristics of an epoxy molding compound were analyzed for low pressure transfer molding in circular channels and in a semicircular channel of the EMMI spiral flow mold. A molding apparatus having transducers for detecting material pressure and plunger displacement was used for the determination of apparent mean viscosity during material flowing. For the calculation of transient temperatures of the material in each channel, equations describing unsteady heat conduction in the cross section perpendicular to the axial direction were solved numerically. In the circular channels having equivalent cross-sectional areas to those of runners used for manufacturing, viscosity was shown to decrease with time due to delayed material temperature rise. In the semicircular channel of the EMMI mold having very small cross-sectional area, minimum viscosity was observed in a few seconds from the flow start and was shown to increase during most of the flowing time due to rapid material temperature rise.
収録刊行物
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- 高分子論文集
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高分子論文集 45 (2), 97-103, 1988
公益社団法人 高分子学会
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詳細情報 詳細情報について
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- CRID
- 1390282681499043328
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- NII論文ID
- 130003837128
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- ISSN
- 18815685
- 03862186
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可
