ホスファゼン誘導体によるエポキシ樹脂の硬化

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タイトル別名
  • Curing of epoxy resin with phosphazene derivatives.
  • ホスファゼン ユウドウタイ ニ ヨル エポキシ ジュシ ノ コウカ

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抄録

Two types of epoxy precursors; bisphenol A (EPIKOTE 828) and phenol novolak (EPIKOTE 154), were cured by 4 kinds of phosphazene derivatives; hexa (4-aminophenoxy) cyclotriphosphazene (HEXA), tri (4-aminophenoxy) -triphenoxy-cyclotriphosphazene (TRIS), diamino-tetraphenoxy-cyclotriphosphazene (PC10), and trichloro-tridi-methylamino-cyclotriphosphazene (C13). The effects of the curing agents on the dynamic viscoelastic properties of the cured epoxy resins were investigated. The epoxy resin cured by showed the highest storage modulus in the temperature range up to 120°C for EPIKOTE 828 and 150°C for EPIKOTE 154, compared with the epoxy resins cured by the other phosphazene derivatives and m-phenylenediamine. The curing agent HEXA was able to enhance the elastic modulus of EPIKOTE 154 in the temperature range above 200°C.

収録刊行物

  • 高分子論文集

    高分子論文集 45 (11), 851-856, 1988

    公益社団法人 高分子学会

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