ノボラック系ポジ型レジストにおける現像温度とレジスト特性との関係

書誌事項

タイトル別名
  • Relationship Between the Development Temperature and the Resist Characteristic of the Positive-Tone Novolak Resist

抄録

We examined the relationship between the development temperature and the resist properties of the positive-tone novolak resist. The resolution of the resist became higher with increasing development temperature, because the dissolution rate in exposure area was promoted by an acid-base neutralization reaction, and the dissolution rate in unexposed area was suppressed by an azo-coupling reaction with the photosensitive agent.<br/>When the development temperature was 22.5°C, the resist showed the best sensitivity. If the development temperature was lower, the dissolution rate of resist becomes lower by suppressing the acid-base neutralization reaction. If the development temperature was higher, the dissolution rate of resist becomes lower because an azo-coupling reaction which is caused the remaining photosensitive agent in exposed area. The resolution of resist becomes higher with increasing the development temperature, but Eth becomes higher along with it, and the sensitivity of resist becomes lower. Thus, we concluded that the best suitable resist development temperature (17.3°C∼40.0°C) is 22.5°C, taking into account the trade off of resolution and sensitivity.

収録刊行物

  • 高分子論文集

    高分子論文集 69 (11), 639-645, 2012

    公益社団法人 高分子学会

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参考文献 (2)*注記

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詳細情報 詳細情報について

  • CRID
    1390282681501861888
  • NII論文ID
    130004489369
  • DOI
    10.1295/koron.69.639
  • ISSN
    18815685
    03862186
  • 本文言語コード
    ja
  • データソース種別
    • JaLC
    • Crossref
    • CiNii Articles
  • 抄録ライセンスフラグ
    使用不可

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