Introduction to Underfill Resin for Portable Device
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- KUBOYAMA Toshifumi
- ThreeBond Co.,Ltd., Japan
Bibliographic Information
- Other Title
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- アンダーフィル材 概論
- アンダーフィルザイ ガイロン
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Description
Recent trends of underfill resin for portable device were reviewed. In recent years, almost everyone in many countries has at least one or more portable devices such as mobile phone, smart-phone, and portable game consoles. Since these devices are often used under extremely severe condition for various purposes, they are required to have resistibility toward variety of physical and environmental stress. Underfill is one of the effective solutions to protect portable devices from troubles caused by these stresses. The requirements for physical and chemical properties of underfill resins and recent technologies used are described.
Journal
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- NIPPON GOMU KYOKAISHI
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NIPPON GOMU KYOKAISHI 84 (10), 313-320, 2011
THE SOCIRETY OF RUBBER SCIENCE AND TECHNOLOGYY, JAPAN
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Keywords
Details 詳細情報について
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- CRID
- 1390282681538411648
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- NII Article ID
- 10029483707
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- NII Book ID
- AN00269207
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- COI
- 1:CAS:528:DC%2BC38Xjs12gt7c%3D
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- ISSN
- 18840442
- 0029022X
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- NDL BIB ID
- 11272279
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed