Analysis of Electrodeposition Mechanism from Zinc Pyrophosphate and Copper Bath Added with L-histidine

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  • L-ヒスチジンを添加したピロリン酸亜鉛及び銅浴からの電析機構の解析
  • L-ヒスチジン オ テンカ シタ ピロリンサン アエン オヨビ ドウヨク カラ ノ デンセキキコウ ノ カイセキ

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<p>Electrical plating of copper and zinc is actively used as anticorrosion plating for surface treatment of bases for decorative plating. Pyrophosphoric acid is used industrially as a complexing agent for these metals in only a few cases, but pyrophosphoric acid is an excellent complexing agent in terms of uniform electrodepositivity and bath stability. Moreover, reports have described the use of organic additives such as amino acids for zinc pyrophosphate plating.</p><p>This study used electron microscopy, AC impedance method, quartz crystal microbalance method, and charge transfer and mass change for zinc and copper electrodeposition were analyzed to investigate the effect of L-histidine addition to a bath in which pyrophosphoric acid is a complexing agent. Results of copper electrodeposition confirmed that an increase in the charge transfer resistance and a decrease in the amount of electrodeposition were ascribed to L-histidine adsorption. Results of zinc electrodeposition confirmed that increase of the electrode area because of the change in surface area caused the reduction of the charge transfer resistance, and increase of the electrodeposition amount.</p>

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