160 Clarification of the relationship between the strength of a grain boundary and its quality in electroplated copper thin films

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  • TEI Kunio
    Department of Finemechanics, Graduate School of Engineering, Tohoku University
  • SUZUKI Ken
    Fracture and Reliability Research Institute, Grad. School of Eng., Tohoku Univ.
  • MIURA Hideo
    Fracture and Reliability Research Institute, Grad. School of Eng., Tohoku Univ.

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  • 160 めっき銅薄膜における粒界強度と結晶品質の相関性の解明

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