Actions of slurry containing milli-bubbles on lapping plate

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  • ミリバブルを含有したスラリーのラップ定盤上でのスラリー挙動
  • ミリバブル オ ガンユウ シタ スラリー ノ ラップ ジョウバン ジョウ デ ノ スラリー キョドウ

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Abstract

In the lapping process, the actions of the slurry affect lapping efficiency and lapping accuracy of wafers. However, it is not possible to observe the actions of the slurry on the lapping plate. In this study, therefore, an acrylic plate was used instead of the upper plate, and the actions of the slurry at the processing part were visualized using a high-speed camera. In addition, a supply method using a combination of three tube diameters was used to produce air bubbles in the slurry. The results indicated that the flow rate of the slurry including air bubbles on the lapping plate was double that of normal slurry, and the air bubbles in the slurry did not enter the processing part.

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