書誌事項
- タイトル別名
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- Thermal Performance of a Thin Loop Heat Pipe for Mobile Applications
- モバイル キキ ムケ ウスガタ ループヒートパイプ ノ ネツ ユソウ セイノウ
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This paper describes a new cooling solution for the thermal management of mobile electronics. A thin loop heat pipe (LHP) with a thickness of 0.6 mm for the evaporator was fabricated by using a chemical-etching and diffusion-bonding process for thin copper plates, and it was designed in a size of 107 mm×58 mm to be embedded in a smartphone. The thermal performance of the thin LHP was evaluated under various operating conditions by measuring the temperature, and its effect on the smartphone was demonstrated. The thermal resistance of 0.8 K/W between the thin LHP’s evaporator and condenser was achieved at 5 W, at an evaporator temperature of 50 ℃ in the horizontal operation of the thin LHP, and minimum resistance was 0.12 K/W at 20 W. We confirmed that the performance of the thin LHP slightly depends on its operating orientation.
収録刊行物
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- Journal of Smart Processing
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Journal of Smart Processing 5 (4), 233-238, 2016
一般社団法人 スマートプロセス学会 (旧高温学会)
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詳細情報 詳細情報について
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- CRID
- 1390282763083813504
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- NII論文ID
- 130007553021
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- NII書誌ID
- AA12553487
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- ISSN
- 21871337
- 2186702X
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- NDL書誌ID
- 027561409
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可