Thermal Performance of a Thin Loop Heat Pipe for Mobile Applications

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Other Title
  • モバイル機器向け薄型ループヒートパイプの熱輸送性能
  • モバイル キキ ムケ ウスガタ ループヒートパイプ ノ ネツ ユソウ セイノウ

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Abstract

This paper describes a new cooling solution for the thermal management of mobile electronics. A thin loop heat pipe (LHP) with a thickness of 0.6 mm for the evaporator was fabricated by using a chemical-etching and diffusion-bonding process for thin copper plates, and it was designed in a size of 107 mm×58 mm to be embedded in a smartphone. The thermal performance of the thin LHP was evaluated under various operating conditions by measuring the temperature, and its effect on the smartphone was demonstrated. The thermal resistance of 0.8 K/W between the thin LHP’s evaporator and condenser was achieved at 5 W, at an evaporator temperature of 50 ℃ in the horizontal operation of the thin LHP, and minimum resistance was 0.12 K/W at 20 W. We confirmed that the performance of the thin LHP slightly depends on its operating orientation.

Journal

  • Journal of Smart Processing

    Journal of Smart Processing 5 (4), 233-238, 2016

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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