Carbon-nanotube bundle-base bump joint structure for advanced 3D semiconductor devices

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  • Miura Hideo
    Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
  • 鈴木 研
    Department of Mechanical and Aerospace Engineering, School of Engineering, Tohoku University
  • Kim Minsuk
    東北大
  • Osada Ryusaku
    Deparment of Finemechanics, Graduate School of Engineering, Tohoku University

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  • カーボンナノチューブバンドル型バンプ接続実装構造の基礎検討

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