書誌事項
- タイトル別名
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- Effect of the crystallinity on the strength of grain boundaries in Polycrystalline materials
抄録
<p>In this study, grain and grain boundary quality in terms of order of atomic arrangement of electroplated copper thin films was evaluated by using the IQ (Image Quality) value obtained from an electron back-scatter diffraction (EBSD) method, and the grain and grain boundary strength was evaluated by applying micro tensile test. In addition, in order to investigate the relationship between the strength and grain boundary quality, molecular dynamics (MD) simulations were applied to analyze the deformation behavior of a bicrystal sample and its strength. The variation of the strength and deformation property were attributed to the higher defect density around grain boundaries than that in grains, which impeded the development of slip systems.</p>
収録刊行物
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- 計算力学講演会講演論文集
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計算力学講演会講演論文集 2018.31 (0), 290-, 2018
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390282763116572544
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- NII論文ID
- 130007653777
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- ISSN
- 24242799
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可