ステルスダイシングを応用したクラックフリーなデバイスの作製

DOI Web Site

書誌事項

タイトル別名
  • Fabrication of crack-free device using Stealth Dicing

説明

<p>Stealth Dicing (SD) is the innovative laser processing for dicing semiconductor Si wafer developed by Hamamatsu Photonics K. K. In this processing, the laser pulses focus and generate modification in the transparent wafer. The modification regions can become origins of cracks for separation. By the non-contact and internal processing, the SD process has many advantages such as completely dry process, high speed, high quality, low kerf loss and low running costs. However, due to generating modification by SD processing, the modified region remains on the cross section of the chip. It may adversely affect the device as a crack. In this study, in order to solve the crack problem, we examined a method for fabricating a crack-free device which does not leave process traces on its cross section.</p>

収録刊行物

  • 年次大会

    年次大会 2018 (0), J2230101-, 2018

    一般社団法人 日本機械学会

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ