Synthesis and Properties of Cresol Novolac Resins Using Monosaccharide:

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  • Hirohito Yamasaki
    * National Institute of Technology, Ube College, Department of Chemical & Biological Engineering
  • Tomomi Igita
    * National Institute of Technology, Ube College, Department of Chemical & Biological Engineering
  • Takahisa Furumoto
    Meiwa Plastic Industries, Ltd., Technical Engineering Department
  • Sadaaki Kuroiwa
    Meiwa Plastic Industries, Ltd., Technical Engineering Department
  • Seiichirou takabayashi
    Meiwa Plastic Industries, Ltd., Technical Engineering Department

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Other Title
  • 単糖を用いたクレゾールノボラック樹脂の合成と性質：
  • 単糖を用いたクレゾールノボラック樹脂の合成と性質 : 柔軟性をもつフォトレジスト材の開発
  • タントウ オ モチイタ クレゾールノボラック ジュシ ノ ゴウセイ ト セイシツ : ジュウナンセイ オ モツ フォトレジストザイ ノ カイハツ

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Abstract

<p>Cresol formaldehyde novolac resins (Cre/Form) are used as photo-resist materials because they can be applied minutely onto hard silicon wafers, which are used in the process of making integrated semiconductor circuits. Resins with high hardness cannot be applied minutely onto flexible bases, such as polyimide films. To develop novolac resins for photo-resists having flexibility beyond that of Cre/Glu novolac resin using glutaraldehyde (Glu) as a crosslinking agent,5-hydroxymethylfurfural (HMF) derived from fructose (Fru) one of a monosaccharide was used as a crosslinking agent.Synthesis of m-cresol 5-hydroxymethylfurfural novolac resins (m-Cre/HMF) was carried out in a stepwise reaction of m-Cre and HMF obtained at the first step. The obtained m-Cre/HMF novolac resin had Mw from 1200 to 2900, and the dissolving rate for alkaline aq. solution (DR) decreased with increasing Mw. To prepare cast films, resins meeting the condition of DR below 500Å/s were chosen. Cast films of thickness 5 μm onto the polyimides were prepared by spin-coating, heatsetting and then exposing to developer solution. The flexibility of the obtained resins was evaluated by observation with a microscope for their bent parts. The m-Cre/HMF novolac resin showed higher flexibility than that of Cre/Glu novolac resin. The lithography performance of the m-Cre/HMF novolac resin coated onto the silicon wafers in 1.5 μm thickness was examined. The residual membrane thickness was high (99%) and the resist pattern could be drawn up in 5 μm width clearly.</p>

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