過渡解析に用いる半導体パッケージの熱回路網モデルD<sup>2</sup>ELPHIの開発と規格策定

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  • D<sup>2</sup>ELPHI Compact Thermal Model Development and Standardization for Transient Simulation

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<p>This paper introduces D2ELPHI (Dynamic DELPHI), a transient thermal network model for semiconductor packages that has been standardized and published by JEITA (ED-7800). This model is supposed to be used in the time order of 1msec or more. If an assembly manufacturer wants to predict junction temperature of a semiconductor package by computer simulation for an electronic device, a thermal model of that package is required. However, the model cannot be easily created by themselves and must be obtained from the package manufacturer. Thermal resistance network model DELPHI, standardized by EU manufacturers in the mid-1990s, is limited to use for steady-state simulations. The D2ELPHI model is based on the DELPHI model and includes heat capacities to support transient simulation. When setting heat capacities of D2ELPHI model, it is important to reflect heat path of the target package.</p>

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