書誌事項
- タイトル別名
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- Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board
- ナマリ ガラス ト プリント キバン ノ ヨウユウ ニ ヨル キンゾク カイシュウ ト ガラス カラ ノ ナマリ ジョキョ
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<p>Reduction melting methods to remove Pb from lead silicate glasses such as cathode ray tube funnel glass have been extensively studied. In this paper, reduction melting of a model lead glass was conducted using printed circuit board as reductant. Model lead silicate glass, viscosity reducing agent (Na2CO3), and printed circuit board were mixed and melted at 1473 K. Metal phase mainly composed of Pb was formed and settled in the melting glass residue. With increasing printed circuit board addition, the amount of metal phase increased and the concentrations of PbO remained in the glass residue decreased, indicating that addition of printed circuit board is effective to remove Pb from the Pb glass. By EDS analysis, it was confirmed that Cu, Ni and Sn are contained in the metal phase, indicating that metals in printed circuit board are recovered with Pb.</p>
収録刊行物
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- 資源と素材
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資源と素材 136 (4), 25-32, 2020-04-30
一般社団法人 資源・素材学会
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詳細情報 詳細情報について
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- CRID
- 1390285300154120064
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- NII論文ID
- 130007837048
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- NII書誌ID
- AA12188381
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- ISSN
- 18840450
- 18816118
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- NDL書誌ID
- 030593364
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可