書誌事項
- タイトル別名
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- Influence of Cryogenic High–Speed Rolling on Tensile Strength and Electric Conductivity of Cu–Ni–Si Alloy Sheet
- Cu-Ni-Si ゴウキンバン ノ キョウド ト ドウデンリツ ニ オヨボス キョクテイオン コウソク アツエン ノ エイキョウ
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抄録
<p>Cu–2.3%Ni–0.55%Si (mass%) sheets, which had been aged at 723K after solution treatment at 1173K or 1273K, were subsequently processed by either (a) low–speed rolling (LSR) (5 m/min at RT) or (b) cryogenic high–speed rolling (C–HSR) (1500 m/min at 77K). The total reduction in thickness of 78% was applied in 3–pass operation. Mechanical properties, electrical conductivity, and microstructure of the as–rolled sheets were investigated. The LSRed sheet showed tensile strength of 731 MPa and electrical conductivity of 27.9%IACS, while the C–HSRed sheet showed 822 MPa and 26.2%IACS. The C–HSRed sheets contains more deformation twins and shear bands in the microstructure than the LSRed sheet. Using a modified Hall–Petch equation, it is recognized that the higher strength of the C–HSRed sheet is attributed to fine–grained microstructure and increased dislocation density.</p>
収録刊行物
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- 銅と銅合金
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銅と銅合金 59 (1), 213-218, 2020
日本銅学会
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詳細情報 詳細情報について
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- CRID
- 1390286426516737664
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- NII論文ID
- 130007940873
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- NII書誌ID
- AA11995570
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- ISSN
- 2435872X
- 13477234
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- NDL書誌ID
- 030594284
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可