Epoxy Resins with High Heat Resistance via a New Process

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  • Hajime Kimura
    Organic Materials Research Division, Morinomiya Center, Osaka Research Institute of Industrial Science and Technology
  • Keiko Ohtsuka
    Organic Materials Research Division, Morinomiya Center, Osaka Research Institute of Industrial Science and Technology
  • Morio Yonekawa
    Organic Materials Research Division, Morinomiya Center, Osaka Research Institute of Industrial Science and Technology

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Other Title
  • 新しいプロセスによる高耐熱性エポキシ樹脂の開発
  • アタラシイ プロセス ニ ヨル コウタイネツセイ エポキシ ジュシ ノ カイハツ

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<p>To develop highly heat-resistant epoxy resins, the curing behavior of an epoxy resin and the properties of the resulting cured product were investigated using an acid anhydride containing a phenylethynylcarbonyl group as curing agents. The results indicated that reaction between the acid anhydride group and the epoxy group first proceeded at about 150 to 170℃, followed by reaction between the phenylethynylcarbonyl groups at about 250 to 300℃. The reaction between phenylethynylcarbonyl groups proceeded more efficiently at a lower temperature when the anthracene-modified epoxy resin was used. The resulting product exhibited very good heat resistance. The crosslink density was increased by polymerization of the phenylethynylcarbonyl group, and the resulting polyene structure strengthened intermolecular interactions, likely due to the limited freedom of movement of the molecular chains.</p>

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