Synthesis and Properties of Hyperbranched Aromatic Polyimides via Thermal Self-Polycondensation
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- SENTHIL Kannan
- <sub>Department of Materials Science, Graduate School of Engineering Science, Akita University, </sub>
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- HATA Ryoya
- <sub>Department of Materials Science, Graduate School of Engineering Science, Akita University, </sub>
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- MATSUMOTO Kazuya
- <sub>Department of Materials Science, Graduate School of Engineering Science, Akita University, </sub>
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- JIKEI Mitsutoshi
- <sub>Department of Materials Science, Graduate School of Engineering Science, Akita University, </sub>
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説明
<p>The thermal self-polycondensation of 4-(3,5-bis(4-aminophenoxy)phenoxy)phthalic acid, an AB2 type monomer, proceeded successfully at 140°C to form a hyperbranched poly(amic acid). The subsequent chemical imidization of the poly(amic acid) afforded hyperbranched aromatic polyimides bearing acetylamide (HBPI-Ac) or imide terminal (HBPI-Im) groups. The formation of high molecular weight polymers was confirmed by gel permeation chromatography measurements using a light scattering detector. The resulting polymers exhibited good solubility and low solution viscosity, which is typical for hyperbranched polymers. The degree of branching of HBPI-Ac was determined to be 0.48. Moreover, the 1H NMR measurement of the model phthalic acid compound at 120°C suggested that the formation of carboxyl anhydride units facilitated the amide bond formation, resulting in the hyperbranched poly(amic acid). HBPI-Im showed the temperature for a 5 % weight loss at 470°C, which was much higher than that of HBPI-Ac (400°C). HBPI-Im film, coated on a glass plate, became insoluble in amide solvents after heating at 280 °C for 10 min, indicating that it could be applied as a solvent-resistant and thermally stable coating in the microelectronics industry.</p>
収録刊行物
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- International Journal of the Society of Materials Engineering for Resources
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International Journal of the Society of Materials Engineering for Resources 24 (1_2), 23-28, 2020-06-01
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詳細情報 詳細情報について
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- CRID
- 1390288691668583424
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- NII論文ID
- 130008064085
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- NII書誌ID
- AA1095475X
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- ISSN
- 18846629
- 13479725
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- NDL書誌ID
- 032469581
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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