An Experimental Study on Liquid Fluorinert Cooling of High-Power IC Chips

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  • Gima Satoru
    Department of Mechanical Systems Engineering Faculty of Engineering, Ryukyus University
  • Tomimura Toshio
    Institute of Advanced Material Study, Kyushu University
  • Zhang Xing
    Institute of Advanced Material Study, Kyushu University
  • Fujii Motoo
    Institute of Advanced Material Study, Kyushu University

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Other Title
  • フロリナートによる高出力ICチップの液体冷却に関する実験的研究
  • フロリナート ニ ヨル コウシュツリョク IC チップ ノ エキタイ レイキャク ニ カンスル ジッケンテキ ケンキュウ

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Abstract

Fluorinert cooling of high-power IC chips using a closed type thermosyphon loop is investigated fundamentally to cope with the recent rapid rise in heat dissipation density of notebook computers. The present experimental set-up consists of evaporator and condenser sections connected by flexible tubing. The evaporator section corresponds to a high-power IC chip, and the condenser section represents a cooling plate located behind a display of notebook computers. The evaporator has the size of 50mm×50mm×20mm outside dimensions, and the condenser is made of a copper plate with heat transfer area of 150×200mm^2 and thickness of 1.5mm. The effects of the heat input, the filled volume of Fluorinert liquid and the inclination angle of condenser on the heat transfer characteristics of the system are studied experimentally.

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