Liquid film flow simulation using particle method involving potential model for surface tension

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  • ポテンシャルモデルによる表面張力を用いた液膜流れの粒子法シミュレーション

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<p>Dynamic wetting behaviors of water on the surface of structures are of great interest in industry. In this study, a liquid film flow on an inclined plate is numerically simulated by using the MPS method, focusing on the liquid dripping around the edge of the plate. In order to simulate such dripping behavior, it is important to calculate surface tension forces with taking the contact angle into account stably and accurately, under large free-surface deformations. For this reason, the surface tension forces are calculated using Kondo’s potential model, which is known as a highly robust surface tension model. Numerical simulations of a liquid film flow are carried out with varying inclination angle and contact angle. As a result, it is found that the occurrence of liquid dripping predominantly depends on the contact angle. The same tendency is also observed in experimental measurements.</p>

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