放熱グリース

柏谷 智, 半澤 和樹

doi:10.18914/tribologist.67.10_705

書誌事項

タイトル別名

Thermal Grease
―Tribological Issues with Thermal Grease―
―放熱グリースのトライボロジー的課題―

説明

<p>The amount of heat generated is increasing with the recent improvement in the performance of semiconductor products. In addition, the heat generation density is increasing with the high-density mounting of each component. Furthermore, an increase in the amount of heat generated causes an increase in the temperature of the environment in which the Thermal Interface Materials (TIM) is used, and improvement in the heat resistance of TIM is required. In this report, thermal grease is taken up as a TIM, and its tribological features and issues are explained.</p>

収録刊行物

トライボロジスト

トライボロジスト 67 (10), 705-710, 2022-10-15

一般社団法人日本トライボロジー学会

キーワード

詳細情報詳細情報について

CRID: 1390293788341277184

DOI: 10.18914/tribologist.67.10_705

ISSN: 21899967; 09151168

本文言語コード: ja

データソース種別

JaLC

抄録ライセンスフラグ: 使用不可

書き出し

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