High Output Power Optical Active Device and Mounting Technique for Beyond 100 Gbit/s Operation

DOI

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Other Title
  • 100 Gbit/s超級動作向け実装技術と高出力光アクティブデバイス

Abstract

We developed high-frequency and integrated design based on flip-chip interconnection technique (Hi-FIT) for beyond 100-Gbit/s operation. This technique can increase the modulation bandwidth thanks to the wire-free interconnection technique. The fabricated Hi-FIT EADFB laser module has the 3-dB bandwidth of 59 GHz and we achieved 4-PAM transmission with the data rate of 214 Gbit/s. We developed SOA assisted extended reach EADFB laser (AXEL). This device can increase the modulation optical output power with low power consumption. We demonstrated 106-Gbit/s 4-PAM signal 60-km fiber-amplifier-less transmission with the optical modulation amplitude of +7.6 dBm.

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