High Output Power Optical Active Device and Mounting Technique for Beyond 100 Gbit/s Operation
-
- KANAZAWA Shigeru
- NTT Corporation
-
- SHINDO Takahiko
- NTT Corporation
-
- CHEN Mingchen
- NTT Corporation
-
- NAKANISHI Yasuhiko
- NTT Corporation
-
- NAKAMURA Hirotaka
- NTT Corporation
Bibliographic Information
- Other Title
-
- 100 Gbit/s超級動作向け実装技術と高出力光アクティブデバイス
Abstract
We developed high-frequency and integrated design based on flip-chip interconnection technique (Hi-FIT) for beyond 100-Gbit/s operation. This technique can increase the modulation bandwidth thanks to the wire-free interconnection technique. The fabricated Hi-FIT EADFB laser module has the 3-dB bandwidth of 59 GHz and we achieved 4-PAM transmission with the data rate of 214 Gbit/s. We developed SOA assisted extended reach EADFB laser (AXEL). This device can increase the modulation optical output power with low power consumption. We demonstrated 106-Gbit/s 4-PAM signal 60-km fiber-amplifier-less transmission with the optical modulation amplitude of +7.6 dBm.
- Tweet
Details 詳細情報について
-
- CRID
- 1390293876713251328
-
- ISSN
- 18810217
-
- Text Lang
- ja
-
- Data Source
-
- JaLC
-
- Abstract License Flag
- Disallowed