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Cooling technology utilizing two-phase immersion cooling by lotus-type porous copper
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- IDE Takuya
- Lotus Thermal Solution, Inc
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- MURAKAMI Masaaki
- Lotus Thermal Solution, Inc
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- YUKI Kohei
- Sanyo-Onoda City University
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- YUKI Kazuhisa
- Sanyo-Onoda City University
Bibliographic Information
- Other Title
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- ロータス型ポーラス金属による沸騰促進を利用した沸騰冷却技術
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Description
<p>In order to solve the thermal problem of SiC-based automotive inverters with high heat generation of 500 W/cm2, the boiling surfaces composed of a lotus copper joined to a grooved surface is developed. The critical heat flux and the maximum heat transfer coefficient of boiling surfaces are the highest 534 W/cm2 and 115 kW/(m2 •K) in the case of water.The boiling surface is expected to be applied not only to the cooling for automotive inverters but also to the cooling for server-system.</p>
Journal
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- Oyo Buturi
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Oyo Buturi 92 (1), 16-19, 2023-01-01
The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1390294643565876480
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- ISSN
- 21882290
- 03698009
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- Text Lang
- ja
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- Data Source
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- JaLC
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- Abstract License Flag
- Disallowed