Soldering of Quad Flat Package IC Using A Laser Beam Scanning System
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- Tsuchiya Hitoshi
- Shibaura Inst. of Tech. Toshiba Corp. Mfg. Eng. Ctr.
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- Homma Tetsuya
- Shibaura Inst. of Tech.
Bibliographic Information
- Other Title
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- レーザ光スキャンシステムを用いたQFP-ICはんだ付け
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2015.1 (0), 761-761, 2015-02-26
The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1390296066525598848
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC