Low thermal resistance insulating thin film primer using oriented mesogenic epoxy resin

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  • 縦配向メソゲンエポキシ樹脂を用いた低熱抵抗絶縁薄膜プライマー

Abstract

<p>Low thermal resistant insulating thin film primers based on self-ordered homeotropically oriented mesogenic epoxy resins were investigated using X-ray diffraction analysis. Two types of primers were compared, one is a crystalline monomer type (ME) and another is an oligomer type (MEP), which is a lower melting point version of ME. Both primers showed strong periodic structures (monodomain structures) and random higher-order structures (polydomain structures) on glass slide, aluminum and copper substrates. The orientation slope of the molecules on the substrates was two times larger for ME than for MEP, indicating a stronger vertical orientation. The thermal conductivity in the direction of thickness of the ME primer, prepared on a copper foil with a thickness of approximately 1.6 µm, was 3.7 W･m－1･K－1, approximately 18 times that of a conventional epoxy resin, while the MEP primer showed 0.3 W･m－1･K－1, about 1.5 times that of a conventional epoxy resin. The volume resistivity of both primers was >1018 Ω･m, indicating that they, particularly ME primer, have sufficient electrical insulation performance and are effective as insulating thin films that can contribute to improving the heat transfer efficiency between different materials.</p>

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