Prototype wearable sensor and structural study using electromechanical design environment.
Bibliographic Information
- Other Title
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- ウェアラブルセンサの試作とエレメカ設計環境を使った構造検討
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 36 (0), 24B3-1-, 2022
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390298200989326592
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- Text Lang
- ja
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- Data Source
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- JaLC